CVD Diamond-Fibre-Reinforced Composites

We are investigating methods to fabricate diamond-fibre-reinforced matrix composite materials for possible use in advanced aerospace applications. The diamond fibres are made as described previously, and photos can be seen on the SEM photos page.

Metal Matrix Composites (MMCs)

MMCs are composites where the matrix material is a metal, for example Ti, reinforced with diamond fibres. The MMCs are made by a process called Hot Isostatic Pressing (HIP) at Farnborough. The SEM photos below show various pictures at increasing magnification of a Ti-alloy MMC reinforced with a number of diamond-coated Textron (SiC) fibres.

Diamond fibre reinforced MMC Diamond fibre reinforced MMC
Diamond fibre reinforced MMC Diamond fibre reinforced MMC

In this case the diamond fibres were long (10 cm) and aligned in the same direction. This provides a huge increase in stiffness in one direction (i.e. anisotropically), and the composite has the advantage of being lightweight.

Plastic Composites

We have also made a number of plastic composites reinforced with diamond fibres. The plastic chosen was perspex (PMMA) since this was easily made in the lab, was transparent, and had a Young's modulus significantly smaller than that of the diamond fibres. We found that only 1% volume fraction of diamond fibres would increase the Young's modulus of the composite bar by a factor of six! In these composites, around 100 aligned diamond fibres were used.

PMMA composite

The world's first plastic (PMMA) composite reinforced with about 100 diamond fibres. Actual size is 100x20x5 mm.

PMMA composite

Side view of another PMMA composite, with 2 layers of diamond fibre reinforcement.

Plastic Thermal 'Heat Pipes'

Plastic composites with aligned diamond fibres do not conduct electricity, but do conduct heat well along the direction of the fibres. The heat travels rapidly down the length of the diamond coatings to a heat sink at the other end of the composite bar, raising the possibility of using these composites as 'heat pipes' - removing the localised heat from an electronic device and conducting it to an exterior radiator without any of the heat leaking out laterally and damaging nearby sensitive components.

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